Bain et méthode de placage électrolytique au cuivre

Kupfer-Elektroplattierbad und -verfahren

Copper electroplating bath and method


Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.




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Patent Citations (4)

    Publication numberPublication dateAssigneeTitle
    US-6610192-B1August 26, 2003Shipley Company, L.L.C.Copper electroplating
    US-6800188-B2October 05, 2004Ebara-Udylite Co., Ltd., Ebara CorporationCopper plating bath and plating method for substrate using the copper plating bath
    US-7128822-B2October 31, 2006Shipley Company, L.L.C.Leveler compounds
    US-7374652-B2May 20, 2008Rohm And Haas Electronic Materials LlcPlating method

NO-Patent Citations (1)

    THERMAL STRESS: "Plated-Through Holes", May 2004, IPC (NORTHBROOK

Cited By (1)

    Publication numberPublication dateAssigneeTitle
    EP-2586893-A3July 09, 2014Rohm and Haas Electronic Materials LLCKupferplattierbad und -verfahren